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Overview

VVDN DC-SCM 2.2 is a secure, configurable module designed for seamless integration with OCP Hardware Platform Management (HPM) systems. Powered by an NXP i.MX95-based BMC and Lattice MachXO 5D, it integrates Root of Trust (RoT), Platform Firmware Resiliency (PFR), and programmable platform control.

It simplifies server integration through firmware-configurable I/O, scalable management, and enhanced security while reducing hardware redesign. The platform supports OCP DC-SCM 2.2, backward compatibility with DC-SCM 2.0, and DC-SCI-based integration.

Key Highlights:

  • Configurable Platform I/O: Enables firmware-based remapping of supported HPM interfaces through programmable CPLD logic, reducing the need for PCB redesign.
  • Integrated Security and Platform Control: Combines RoT and CPLD functionality in a single Lattice MachXO 5D device, supporting PFR, power/reset sequencing, and platform control.
  • Advanced BMC Architecture: Powered by the NXP i.MX95 application processor, with integrated graphics and NPU capabilities to support future intelligent management and AI/ML applications.
  • Scalable BMC-to-CPLD Communication: Dedicated QSPI mailbox supports platform interface expansion and simplifies integration as requirements evolve.
  • Enhanced Firmware Resilience: Supports secure firmware handling, firmware recovery, and flexible TPM implementation.
  • Intelligent Server Management: Provides a foundation for telemetry, diagnostics, remote serviceability, and future AI-assisted health monitoring.
  • Standards-Based Design: Supports OCP DC-SCM 2.2, backward compatibility with DC-SCM 2.0, IPMI 2.0, Redfish, and NIST SP 800-193-aligned platform firmware resiliency.

Technical Specifications

Parameter Specification
Module
  • VVDN DC-SCM 2.2
Standard
  • OCP DC-SCM 2.2; DC-SCM 2.0 backward compatible
BMC Processor
  • NXP i.MX95
Security and CPLD
  • Lattice MachXO 5D — RoT + CPLD
Security Features
  • PFR, secure firmware handling, firmware recovery
TPM Support
  • Firmware TPM and external TPM
Memory
  • 2 GB LPDDR5 @ 4268 MT/s
Storage
  • 8 GB eMMC
BMC Firmware Storage
  • 128 MB SPI NOR
BIOS Firmware Storage
  • 32 MB SPI NOR
Ethernet
  • 1 GbE management
USB
  • USB 3.0 and USB 2.0
Display / KVM
  • Mini DisplayPort / KVM
Platform Interfaces
  • LTPI, QSPI mailbox, I2C/I3C, UART, GPIO, SPI, eSPI
Management Standards
  • IPMI 2.0, Redfish
Firmware Resiliency
  • NIST SP 800-193 compliant, as specified in the presentation
Input Voltage
  • 12 V
Power Consumption
  • Approximately 14 W typical; 25 W maximum
Operating Temperature
  • 0°C to 85°C
Board Dimensions
  • 120.4 × 90 mm
PCB Thickness
  • 1.6 mm

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